2023年(令和5年)論文

学術論文

H. Ito, M. Yoshida, Y. Yano, J. Wang, T. Ishida and M. Sawada, “Comparison of ESD damage test for common-mode chokes with ESD gun and TLP-HMM,” IEEE Letters on Electromagnetic Compatibility Practice and Applications, vol. 5, no. 1, pp. 10-15, March 2023, doi:10.1109/LEMCPA.2022.3222019.

Y. Yano, K. Ishida, J. Wang, and T. Ishida, Influence of cable length between TLP test system and DUT and its correction for CMC ESD saturation measurement, IEICE ComEX, vol.12, no.9, pp. 457-463, Sept. 2023.

H. Tanaka, T. Matsushima, Y. Yano and O. Wada, “On-Chip Power Integrity Simulation Using LSI-Core Macromodels Considering Voltage Fluctuations Caused by Inter-Function-Block Interference,” in IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 1, pp. 334-342, Feb. 2023.

国際会議

J. Wang, Wearable devices EMC (Keynote), 2023 IEEE Int. Conf. on Electronic Information and Comm. Tech. (ICEICT), Qingdao, China, July 21-24, 2023.

J. Wang, R. Ito, and K. Imaida, Quantification for setting the electric field Strength to achieve an exposure level of 6 W/kg in a reverberation chamber, Presented at the 45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023), Sydney, Australia, July 24-27, 2023.

L. Liu, H. Takagi, K. Miyazaki, and J. Wang, Performance evaluation of 10-60 MHz implant communication at 20 Mb/s using signal pre-emphasis technique, Presented at the 45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023), Sydney, Australia, July 24-27, 2023.

M. Yoshida, Y. Yano, T. Ishida, and J. Wang, Improvement of TLP-HMMs load dependence, Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 Aug. 4, 2023.

Y. Yano, H. Iwasaki, and J. Wang, Investigation of reducing test system dependence for automotive Ethernet EMC evaluation, Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 Aug. 4, 2023.

M. Hara, J. Wang, and F. Leferink, Wall shaking amplitude effects on vibrating intrinsic reverberation chamber characteristics, Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 Aug. 4, 2023.

L. Liu, H. Takagi, J. Shi and J. Wang, SAR evaluation for bandwidth-enhanced implant communication system with pre-emphasis technique, Presented at URSI GASS 2023, KE-2, Sapporo, Japan, Aug. 19-26, 2023.

T. Matsushima, A. Kagawa, Y. Yano and Y. Fukumoto, “Cable Height Dependence in Radiated Immunity Evaluation of Automotive Ethernet 100BASE-T1,” Presented at the 35th URSI General Assembly and Scientific Symposium (URSI GASS 2023), Sapporo, Japan, Aug. 2023.