Papers
Ito, M. Yoshida, Y. Yano, J. Wang, T. Ishida and M. Sawada, “Comparison of ESD damage test for common-mode chokes with ESD gun and TLP-HMM,” IEEE Letters on Electromagnetic Compatibility Practice and Applications, vol. 5, no. 1, pp. 10-15, March 2023, doi: 10.1109/LEMCPA.2022.3222019.
Y. Yano, K. Ishida, J. Wang, and T. Ishida, “Influence of cable length between TLP test system and DUT and its correction for CMC ESD saturation measurement,” IEICE ComEX, vol.12, no.9, pp. 457-463, Sept. 2023.
H. Tanaka, T. Matsushima, Y. Yano and O. Wada, “On-Chip Power Integrity Simulation Using LSI-Core Macromodels Considering Voltage Fluctuations Caused by Inter-Function-Block Interference,” in IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 1, pp. 334-342, Feb. 2023.
International conference
J. Wang, “Wearable devices EMC” (Keynote), 2023 IEEE Int. Conf. on Electronic Information and Comm. Tech. (ICEICT), Qingdao, China, July 21-24, 2023.
J. Wang, R. Ito, and K. Imaida, “Quantification for setting the electric field Strength to achieve an exposure level of 6 W/kg in a reverberation chamber,” Presented at the 45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023), Sydney, Australia, July 24-27, 2023.
L. Liu, H. Takagi, K. Miyazaki, and J. Wang, “Performance evaluation of 10-60 MHz implant communication at 20 Mb/s using signal pre-emphasis technique,” Presented at the 45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023), Sydney, Australia, July 24-27, 2023.
M. Yoshida, Y. Yano, T. Ishida, and J. Wang, “Improvement of TLP-HMM’s load dependence,” Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 – Aug. 4, 2023.
Y. Yano, H. Iwasaki, and J. Wang, “Investigation of reducing test system dependence for automotive Ethernet EMC evaluation,” Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 – Aug. 4, 2023.
M. Hara, J. Wang, and F. Leferink, “Wall shaking amplitude effects on vibrating intrinsic reverberation chamber characteristics,” Presented at 2023 IEEE Int. Symp. on EMC, Signal & Power Integrity, Grand Rapids, Michigan, USA, July 31 – Aug. 4, 2023.
L. Liu, H. Takagi, J. Shi and J. Wang, “SAR evaluation for bandwidth-enhanced implant communication system with pre-emphasis technique,” Presented at URSI GASS 2023, KE-2, Sapporo, Japan, Aug. 19-26, 2023.
T. Matsushima, A. Kagawa, Y. Yano and Y. Fukumoto, “Cable Height Dependence in Radiated Immunity Evaluation of Automotive Ethernet 100BASE-T1,” Presented at the 35th URSI General Assembly and Scientific Symposium (URSI GASS 2023), Sapporo, Japan, Aug. 2023.